High performance thermoplastic compositions with improved melt flow properties

ABSTRACT

A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.09/572,119, filed on May 17, 2000, now U.S. Pat. No. 6,673,872 which isfully incorporated herein by reference.

BACKGROUND OF THE INVENTION

High performance thermoplastic polymers such as poly(etherimide)s havebeen used to fabricate parts for numerous applications. Each applicationrequires particular tensile and flexural properties, impact strength,heat distortion temperature (HDT), and resistance to warp. For example,U.S. Pat. No. 4,455,410 provides a poly(etherimide)-poly(phenylenesulfide) blend having good flexural strength characteristics. U.S. Pat.No. 3,983,093 provides poly(etherimide) compositions that have improvedsolvent resistance and are suitable for use in preparing films, moldingcompounds, coatings, and the like.

These thermoplastic polymers are characterized by a high glasstransition temperature, usually above about 180° C., which makes themsuitable for use in applications that require exposure to hightemperatures. A drawback of these materials is that they exhibit poormelt flow properties, which makes processing difficult. Injectionmolding of thermoplastic polymers, for instance, is more easilyperformed with a thermoplastic resin that has a higher melt volume rate(MVR). Good melt flow properties are necessary to achieve fast moldingcycles and to permit molding of complex parts. At the same time,mechanical properties such as impact strength and ductility must bemaintained in order to pass product specifications.

U.S. Pat. No. 4,431,779 to White et al. discloses blends ofpolyetherimide and polyphenylene ether which exhibit good impactstrength as well as good mechanical properties. White et al. focus onthe compatability of polyphenylene ethers with polyetherimide, teachingthat homogenous blends and non-uniform products may result. However, ifamorphous polymers are employed, they are compatible and transparentfilms may be cast. The compatibility of the polyphenylene ethers topolyetherimide lessens as the quantity of aliphatic groups in thepolymer increases. Although White et al. discuss polypheneylene etherpolymers, they fail to teach the effects of such polymers and polymerblends on melt flow characteristics.

There accordingly remains a need in the art for thermoplastic polymerswith improved melt flow properties, without the consequent loss of otherdesirable characteristics in the finished product.

BRIEF SUMMARY OF THE INVENTION

The above-described needs are met by a high performance, thermoplasticpolymer composition having improved melt flow properties, comprising ahigh Tg, thermoplastic polymer resin and a poly(arylene ether) having alow intrinsic viscosity, preferably less than about 0.25 deciliters pergram (dl/g). Addition of low intrinsic viscosity poly(arylene ether)sgenerally have no or minimal detrimental effects on other physicalproperties of the thermoplastic polymer compositions.

DETAILED DESCRIPTION OF THE INVENTION

Addition of a poly(arylene ether) having a low intrinsic viscosity (IV)to high performance, high Tg, amorphous thermoplastic polymers provideshighly improved melt flow properties to such polymers, without causingdegradation of important mechanical properties such as impact strengthand ductility. Other optional additives may also be used in thecompositions to obtain other desired polymer properties.

Suitable high performance, high Tg thermoplastic polymer resins areknown in the art, and typically have glass transition temperatures (Tg)of about 170° C. or greater, with about 200° C. or greater preferred.Exemplary resins include poly(imide), poly(sulfone), poly(ethersulfone), and other polymers.

Useful thermoplastic poly(imide) resins have the general formula (I)

wherein a is more than 1, typically about 10 to about 1,000 or more, andmore preferably about 10 to about 500; and V is a tetravalent linkerwithout limitation, as long as the linker does not impede synthesis oruse of the polyimide. Suitable linkers include but are not limited to:(a) substituted or unsubstituted, saturated, unsaturated or aromaticmonocyclic and polycyclic groups having about 5 to about 50 carbonatoms, (b) substituted or unsubstituted, linear or branched, saturatedor unsaturated alkyl groups having 1 to about 30 carbon atoms; orcombinations comprising at least one of the foregoing. Suitablesubstitutions and/or linkers include, but are not limited to, ethers,epoxides, amides, esters, and combinations comprising at least one ofthe foregoing. Preferred linkers include but are not limited totetravalent aromatic radicals of formula (II), such as

wherein W is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)— (y being aninteger from 1 to 10), and halogenated derivates thereof, includingperfluoroalkylene groups, or a group of the formula —O-Z-O— wherein thedivalent bonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′,4,3′, or the 4,4′ positions, and wherein Z includes, but is not limited,to divalent radicals of formula (III).

R in formula (I) includes but is not limited to substituted orunsubstituted divalent organic radicals such as: (a) aromatichydrocarbon radicals having about 6 to about 20 carbon atoms andhalogenated derivatives thereof; (b) straight or branched chain alkyleneradicals having about 2 to about 20 carbon atoms; (c) cycloalkyleneradicals having about 3 to about 20 carbon atoms, or (d) divalentradicals of the general formula (IV)

wherein Q includes but is not limited to a divalent moiety selected fromthe group consisting of —O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—,C_(y)H_(2y-2)— (y being an integer from 1 to 10), and halogenatedderivatives thereof, including perfluoroalkylene groups.

Preferred classes of poly(imide) polymers include poly(amide imide)polymers and poly(etherimide) polymers, particularly thosepoly(etherimide) polymers known in the art which are melt processable,such as those whose preparation and properties are described in U.S.Pat. Nos. 3,803,085 and 3,905,942, each of which is incorporated hereinby reference.

Preferred poly(etherimide) resins comprise more than 1, typically about10 to about 1000 or more, and more preferably about 10 to about 500structural units, of the formula (V)

wherein T is —O— or a group of the formula —O-Z-O— wherein the divalentbonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, orthe 4,4′ positions, and wherein Z includes, but is not limited, todivalent radicals of formula (III) as defined above.

In one embodiment, the poly(etherimide) may be a copolymer which, inaddition to the etherimide units described above, further containspoly(imide) structural units of the formula (VI)

wherein R is as previously defined for formula (I) and M includes, butis not limited to, radicals of formula (VII).

The poly(etherimide) can be prepared by any of the methods known tothose skilled in the art, including the reaction of an aromaticbis(ether anhydride) of the formula (VIII)

with an organic diamine of the formula (IX)H₂N—R—NH₂  (IX)wherein T and R are defined as described above in formulas (I) and (IV).

Examples of specific aromatic bis(ether anhydride)s and organic diaminesare disclosed, for example, in U.S. Pat. Nos. 3,972,902 and 4,455,410,which are incorporated herein by reference. Illustrative examples ofaromatic bis(ether anhydride)s of formula (VIII) include:2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (i.e., thedianhydride of bisphenol-A); 4,4′-bis(3,4-dicarboxyphenoxy)diphenylether dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfidedianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride;4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride;2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride;4,4′-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride;4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride;4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride;4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride;4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl-2,2-propanedianhydride; 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylether dianhydride;4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfidedianhydride;4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenonedianhydride and 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride, as well as variousmixtures of the foregoing aromatic bis(ether anhydride)s.

The bis(ether anhydride)s can be prepared by the hydrolysis, followed bydehydration, of the reaction product of a nitro substituted phenyldinitrile with a metal salt of dihydric phenol compound in the presenceof a dipolar, aprotic solvent. A preferred class of aromatic bis(etheranhydride)s included by formula (VIII) above includes, but is notlimited to, compounds wherein T is of the formula (X)

and the ether linkages, for example, are preferably in the 3,3′, 3,4′,4,3′, or 4,4′ positions, and mixtures of the foregoing linkages, andwhere Q is as defined above.

Many diamino compound may be employed. Examples of suitable compoundsare ethylenediamine, propylenediamine, trimethylenediamine,diethylenetriamine, triethylenetetramine, hexamethylenediamine,heptamethylenediamine, octamethylenediamine, nonamethylenediamine,decamethylenediamine, 1,12-dodecanediamine, 1,18-octadecanediamine,3-methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine,4-methylnonamethylenediamine, 5-methylnonamethylenediamine,2,5-dimethylhexamethylenediamine, 2,5-dimethylheptamethylenediamine,2,2-dimethylpropylenediamine, N-methyl-bis (3-aminopropyl) amine,3-methoxyhexamethylenediamine, 1,2-bis(3-aminopropoxy) ethane,bis(3-aminopropyl) sulfide, 1,4-cyclohexanediamine,bis-(4-aminocyclohexyl) methane, m-phenylenediamine, p-phenylenediamine,2,4-diaminotoluene, 2,6-diaminotoluene, m-xylylenediamine,p-xylylenediamine, 2-methyl-4,6-diethyl-1,3-phenylene-diamine,5-methyl-4,6-diethyl-1,3-phenylene-diamine, benzidine,3,3′-dimethylbenzidine, 3,3′-dimethoxybenzidine, 1,5-diaminonaphthalene,bis(4-aminophenyl) methane, bis(2-chloro-4-amino-3,5-diethylphenyl)methane, bis(4-aminophenyl) propane, 2,4-bis(b-amino-t-butyl) toluene,bis(p-b-amino-t-butylphenyl) ether, bis(p-b-methyl-o-aminophenyl)benzene, bis(p-b-methyl-o-aminopentyl) benzene,1,3-diamino-4-isopropylbenzene, bis(4-aminophenyl) sulfide, bis(4-aminophenyl) sulfone, bis(4-aminophenyl) ether, and1,3-bis(3-aminopropyl) tetramethyldisiloxane. Mixtures comprising atleast one of these compounds may also be present. The preferred diaminocompounds are aromatic diamines, especially m- and p-phenylenediamine,hexamethylenediamine, aliphatic diamines, and mixtures comprising atleast one of the foregoing diamines.

In a particularly preferred embodiment, the poly(etherimide) resincomprises structural units according to formula (V) wherein each R isindependently p-phenylene or m-phenylene or a mixture comprising atleast one of the foregoing Rs, and T is a divalent radical of theformula (XI)

Included among the many methods of making the poly(imide)s, particularlypoly(etherimide) polymers, are those disclosed in U.S. Pat. Nos.3,847,867, 3,814,869, 3,850,885, 3,852,242, 3,855,178, 3,983,093, and4,443,591. These patents are incorporated herein by reference for thepurpose of teaching, by way of illustration, general and specificmethods for preparing polyimides.

In general, the reactions can be carried out employing well-knownsolvents, e.g., o-dichlorobenzene, m-cresol/toluene and the like, toeffect a reaction between the anhydride of formula (VIII) and thediamine of formula (IX), at temperatures of about 100° C. to about 250°C. Alternatively, the poly(etherimide) can be prepared by meltpolymerization of aromatic bis(ether anhydride)s (VIII) and diamines(IX) by heating a mixture of the starting materials to elevatedtemperatures with concurrent stirring. Generally, melt polymerizationsemploy temperatures of about 200° C. to about 400° C. Chain stoppers andbranching agents may also be employed in the reaction. Whenpolyetherimide/polyimide copolymers are employed, a dianhydride, such aspyromellitic dianhydride, is used in combination with the bis(etheranhydride). The poly(etherimide) resins can optionally be prepared fromreaction of an aromatic bis(ether anhydride) with an organic diamine inwhich the diamine is present in the reaction mixture at no more thanabout 0.2 molar excess, and preferably less than about 0.2 molar excess.Under such conditions the poly(etherimide) resin has less than about 15microequivalents per gram (μeq/g) acid titratable groups, and preferablyless than about 10 μeq/g acid titratable groups, as shown by titrationwith chloroform solution with a solution of 33 weight percent (wt %)hydrobromic acid in glacial acetic acid. Acid-titratable groups areessentially due to amine end-groups in the poly(etherimide) resin.

Generally, useful poly(etherimide) resins have a melt flow rate of about1.0 to about 200 grams per ten minutes (“g/10 min”), as measured byAmerican Society for Testing Materials (“ASTM”) D1238 at 337° C., usinga 6.6 kilogram (“kg”) weight. In a preferred embodiment, thepolyetherimide resin has a weight average molecular weight (Mw) of about10,000 to about 150,000 grams per mole (“g/mole”), as measured by gelpermeation chromatography, using a polystyrene standard. Suchpolyetherimide resins typically have an intrinsic viscosity greater thanabout 0.2 deciliters per gram (“dl/g”), preferably about 0.35 to about0.7 dl/g measured in m-cresol at 25° C. Some such polyetherimidesinclude, but are not limited to ULTEM® 1000 (number average molecularweight (Mn) 21,000; weight average molecular weight (Mw) 54,000;dispersity 2.5), ULTEM® 1010 (Mn 19,000; Mw 47,000; dispersity 2.5),ULTEM® 1040 (Mn 12,000; Mw 34,000–35,000; dispersity 2.9), or mixturescomprising at least one of the foregoing polyetherimides.

Poly(sulfone) polymers are derivatives of polysulfides and have morethan one, typically more than 10 repeating units of the formula—Ar—SO₂—. Preferred resins polysulfones are amorphous resins with highresistivity and dielectric strength. Polysulfones have high resistanceto thermo oxidative conditions, and hydrolytic stability, making themsuitable for appliances, electronic components, aircraft interior parts,and biological and medical devices.

The term “sulfone polymer”, as used herein, is intended to encompassthose sulfone polymers featuring the sulfone group. Such materials arewell known and are described in a number of places including, but notlimited to: U.S. Pat. No. 4,080,403, U.S. Pat. No. 3,642,946; ModernPlastics Encyclopedia, 1977–78, pp. 108, 110–11 and 112; Kirk-OthmerEncyclopedia of Chemical Technology, Second Edition, Vol. 16, pp.272–281 (1968); and Handbook of Plastics and Elastomers, C. A. Harper,ed., McGraw-Hill, Inc., 1975 pp. 1–69 and 1–95 to 96; all of which areincorporated herein by reference. Representative polymers of this typeinclude poly(sulfone), poly(ether sulfone), poly(phenyl sulfone) and thelike, as well as mixtures comprising at least one of the foregoingpoly(sulfone)s. Commercially available sulfone polymers include thosesold under the following trademarks: UDEL, RADEL A, RADEL R(commercially available from BP Amoco) and VICTREX (commerciallyavailable from ICI Americas, Inc.).

Suitable poly(arylene ether) polymers are those having low intrinsicviscosities. Poly(arylene ether) polymers are known, comprising aplurality of structural units of the formula (XII)

wherein for each structural unit, each Q¹ is independently halogen,primary or secondary lower alkyl (e.g., alkyl containing up to 7 carbonatoms), phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, orhalohydrocarbonoxy wherein at least two carbon atoms separate thehalogen and oxygen atoms; and each Q² is independently hydrogen,halogen, primary or secondary lower alkyl, phenyl, haloalkyl,hydrocarbonoxy or halohydrocarbonoxy as defined for Q¹. Preferably, eachQ¹ is alkyl or phenyl, especially C₁₋₄ alkyl, and each Q² is hydrogen.Meanwhile, n is less than 50, with less than about 40 preferred, andabout 10 to about 25 especially preferred.

Both homopolymer and copolymer poly(arylene ether) resins may be used.The preferred homopolymers are those containing 2,6-dimethylphenyleneether units. Suitable copolymers include random copolymers containing,for example, such units in combination with2,3,6-trimethyl-1,4-phenylene ether units or copolymers derived fromcopolymerization of 2,6-dimethylphenol with 2,3,6-trimethylphenol. Alsoincluded are poly(arylene ether)-containing moieties prepared bygrafting vinyl monomers or polymers such as polystyrenes, as well ascoupled poly(arylene ether) in which coupling agents such as lowmolecular weight polycarbonates, quinones, heterocycles and formalsundergo reaction in known manner with the hydroxy groups of twopoly(arylene ether) chains to produce a higher molecular weight polymer.Combinations of any of the above may also be used.

The poly(arylene ether) generally has a number average molecular weightof less than 6,000, with about 1,200 to about 4,800 preferred, and about1,200 to about 3,000 especially preferred, as determined by gelpermeation chromatography. Effective improvement in melt flow propertiesis generally achieved by use of poly(arylene ether) resins wherein theintrinsic viscosity (IV) of the resin is below 0.30 deciliters per gram(dl/g), preferably up to about 0.25 dl/g, more preferably up to about0.20 dl/g, and most preferably about 0.10 to about 0.15 dl/g (allmeasured in chloroform at 25° C.).

The poly(arylene ether) ether polymers suitable for use in thisinvention may be prepared by any number of processes known in the artfrom corresponding phenols or reactive derivatives thereof. Poly(aryleneether) resins are typically prepared by the oxidative coupling of atleast one monohydroxy aromatic compound such as 2,6-xylenol or2,3,6-trimethylphenol. Catalysts systems are generally employed for suchcoupling and contain at least one heavy metal compound such as copper,manganese, or cobalt compounds, usually in combination with variousother materials. Catalyst systems containing a copper compound areusually combinations of cuprous or cupric ions, halide (e.g., chloride,bromide, or iodide) ions and at least one amine such as cuprouschloride-trimethylamine. Catalyst systems which contain manganesecompounds are generally alkaline systems in which divalent manganese iscombined with such anions as halide, alkoxide or phenoxide. Most often,the manganese is present as a complex with one or more complexing and/orchelating agents such as dialkylamines, alkylenediamines, o-hydroxyaromatic aldehydes, o-hydroxyazo compounds and o-hydroxyaryl oximes.Examples of manganese containing catalysts include manganesechloride-and manganese chloride-sodium methylate. Suitable cobalt typecatalyst systems contain cobalt salts and an amine.

Examples of catalyst systems and methods for preparing poly(aryleneether) resins are set forth in U.S. Pat. Nos. 3,306,874, 3,306,875,3,914,266 and 4,028,341 (Hay), 3,257,357 and 3,257,358 (Stamatoff),4,935,472 and 4,806,297 (S.B. Brown et al.) and 4,806,602 (White etal.).

In general, the molecular weight of the poly(arylene ether) resins canbe controlled by controlling the reaction time, the reaction temperatureand the amount of catalyst. Long reaction times provide a higher averagenumber of repeating units and a higher intrinsic viscosity. At somepoint, a desired molecular weight (intrinsic viscosity) is obtained andthe reaction terminated by conventional means. For example, in the caseof reaction systems which make use of a complex metal catalysts, thepolymerization reaction may be terminated by adding an acid, e.g.,hydrochloric acid, sulfuric acid and the like or a base e.g., potassiumhydroxide and the like and the product is separated from the catalyst byfiltration, precipitation or other suitable means as taught by Hay inU.S. Pat. No. 3,306,875. The ultra low intrinsic viscosity poly(aryleneether) resin may be recovered from the reaction solution used in thesynthesis of higher molecular weight resins after the higher molecularweight resins have been separated.

It is preferable to employ ultra low IV poly(arylene ether) resin thatis not recovered from a reaction solution by precipitation in anon-solvent. The solids recovered by these techniques are too fine andlight, i.e. have an unacceptably low bulk density, to properly feed intoprocessing equipment. It is preferable to employ ultra low IVpoly(arylene ether) resin that is recovered from the reaction solutionas a solid mass or in the form of an agglomerate having a size of atleast 100 μm; preferably of a size greater than 1 mm. Agglomerates canbe formed by spray drying the reaction solution. The ultra low IVpoly(arylene ether) resin can be recovered as a solid mass inconventional equipment where the solvent is stripped off at elevatedtemperatures. This can be accomplished in conventional vented extruders,or vacuum/vented extruders, as such described in U.S. Pat. No.5,204,410, or film evaporators, such as described in U.S. Pat. Nos.5,419,810 and 5,256,250. The reaction solution may be concentrated asdescribed in U.S. Pat. No. 4,692,482 to facilitate the removal ofsolvent performed by this equipment and minimize the exposure of theultra low viscosity poly(arylene ether) resin to thermal stress. Forminga solid mass enables the ultra low viscosity poly(arylene ether) to bepelletized to a conventional pellet size of about 3 millimeters (mm) orany desired size. The ultra low IV poly(arylene ether) is preferably ofa conventional pellet size so that it can be easily handled in feedhoppers for the equipment used to form the poly(arylene ether) blendwith the high Tg amorphous thermoplastic polymer resin, and optionallyadditives. Preferably, this is accomplished with minimal thermal stressso that the formation of impurities is not a problem, as is taught inU.S. patent application Ser. No. 09/547,648, which is incorporatedherein by reference.

Particularly useful poly(arylene ether) polymers are those whichcomprise molecules having at least one aminoalkyl-containing end group.The aminoalkyl radical is typically located in an ortho position to thehydroxy group. Products containing such end groups may be obtained byincorporating an appropriate primary or secondary monoamine such asdi-n-butylamine or dimethylamine as one of the constituents of theoxidative coupling reaction mixture. Also frequently present are4-hydroxybiphenyl end groups, typically obtained from reaction mixturesin which a by-product diphenoquinone is present, especially in acopper-halide-secondary or tertiary amine system. A substantialproportion of the polymer molecules, typically constituting as much asabout 90 wt % of the polymer, may contain at least one of theaminoalkyl-containing and 4-hydroxybiphenyl end groups.

The high performance, thermoplastic polymer compositions having improvedmelt flow properties may optionally comprise various other additivesknown in the art. Exemplary additives include antioxidants, for exampleorganophosphites such as tris(nonyl-phenyl)phosphite,tris(2,4-di-t-butylphenyl)phosphite,bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite and distearylpentaerythritol diphosphite; alkylated monophenols, polyphenols andalkylated reaction products of polyphenols with dienes, such as tetrakis{methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)}methane andoctadecyl 3,5-di-tert-butyl-4-hydroxyhydrocinnamate; butylated reactionproducts of para-cresol and dicyclopentadiene; alkylated hydroquinones;hydroxylated thiodiphenyl ethers; alkylidene-bisphenols; benzylcompounds; esters of beta-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionicacid with monohydric or polyhydric alcohols; esters ofbeta-(5-tert-butyl-4-hydroxy-3-methylphenyl)-propionic acid withmonohydric or polyhydric alcohols; esters of thioalkyl or thioarylcompounds, such as, distearylthiopropionate, dilaurylthiopropionate, andditridecylthiodipropionate; and amides ofbeta-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid.

Additives, i.e. fillers and reinforcing agents, are also known, such as,for example, conductive materials (such as metal flakes, metalparticles, metal fibers, metal coated glass flakes, metal coated micas,carbon fibers, metal coated micas, carbon fibers, carbon nanotubes,metal coated fibers, and the like), silicates, titanium dioxide,ceramics, glass in the form of continuous glass fibers, spheres,particles, flaked glass, milled glass, fiber glass (especially choppedfiber glass), and mixtures comprising at least one of the foregoingglasses, carbon black, graphite, calcium carbonate, talc, and mica, andmixtures comprising at least one of the foregoing fillers andreinforcing agents. Other additives include mold release agents,compatibilizers, UV absorbers, anti-drip agents, stabilizers such aslight stabilizers and others, lubricants, plasticizers, pigments, dyes,colorants, anti-static agents, blowing agents, flame retardants, impactmodifiers, crystallization nucleators, and the like, as well as mixturescomprising at least one of the foregoing additives.

In the present high performance, thermoplastic polymer compositions, thehigh Tg amorphous thermoplastic resin component may be present in anamount of about 40 wt % to about 99.9 weight percent (wt %) of the totalcomposition, with about 50 wt % to about 99 wt % preferred, and about 70wt % to about 95 wt % especially preferred, with the remaindercomprising a quantity of the low intrinsic viscosity poly(aryleneether). The effective quantity of low intrinsic viscosity poly(aryleneether) will vary depending on the properties of the high Tgthermoplastic resin component and any additional components (ifpresent), and is readily determined by one of ordinary skill in the art.Such quantities will generally be in up to about 50 wt % based on thetotal composition, with about 0.1 to about 50 wt % preferred, about 1 toabout 40 wt % more preferred, with about 5 wt % to about 30 wt %especially preferred. The thermoplastic polymer composition can furthercomprise about 0.1 wt % to about 50 wt % additives (e.g., fillers,reinforcing agents, etc.), with about 5 wt % to about 40 wt % preferred,and about 15 wt % to about 30 wt % especially preferred.

The preparation of the high performance, thermoplastic polymercompositions is normally achieved by merely blending the componentsunder conditions suitable for the formation of an intimate blend. Suchconditions may include solution blending or melt mixing in single ortwin screw type extruders, mixing bowl, roll, kneader, or similar mixingdevices that can apply a shear to the components. Twin screw extrudersare often preferred due to their more intensive mixing capability oversingle screw extruders. It is often advantageous to apply a vacuum tothe blend through at least one vent port in the extruder to removevolatile components in the composition.

Meanwhile, the blend is preferably sufficiently heated such that thecomponents are in the molten phase, thereby enabling intimate mixing.Typically, temperatures up to about 350° C. can be employed, with about250° C. to about 350° C. preferred.

The blended, high performance, thermoplastic polymer compositions can bemolded into useful articles, such as, for example, heat resistantcontainers, by a variety of means such as, for example, injectionmolding, compression molding, thermoforming, and blow molding, amongothers conventionally known in the art. All patents cited areincorporated herein by reference.

The invention will be further described by the following examples, whichare meant to be illustrative, not limiting.

EXAMPLES

Table 1: Control 1 and Examples 1 and 2; Control 2 and Examples 3–5.

All formulations were compounded in a 25 millimeter (mm) Werner &Pfleiderer co-rotating twin screw extruder operating at a temperature of360° C., and a speed of 300 rpm. The extrudate was quenched in a waterbath and pelletized.

The pellets were dried for a minimum of 4 hours at 135° C. theninjection molded into various test specimens using a 130 ton Storkinjection molding machine with a melt temperature of 360° C. and a moldtemperature of 140° C. The physical and mechanical properties of theseformulations are reported in Table 1. Details of the test procedures aredescribed in the experimental section that follows.

For Control 1 and Examples 1 and 2, the formulations were prepared with0, 1, and 4 parts, respectively, of low IV (0.12 dl/g) PPO® SA120(poly(phenylene ether) commercially available from GE Plastics,Pittsfield, Mass.) in ULTEM® 1000 (polyetherimide commercially availablefrom GE Plastics, Pittsfield, Mass.). Examples 1 and 2, which containthe low IV PPO®, have significantly better melt flow than the Control 1without any loss in either the tensile or impact properties. The meltflow increases with SA120 PPO® content.

The formulations for Control 2, and Examples 3–5 were prepared using alower molecular weight polyetherimide resin, ULTEM® 1010, with 0, 1, 3and 5 parts of low IV PPO® SA120, respectively. Once again, the flowimproves with increasing levels of low IV PPO® resin without a loss ineither the tensile or impact properties.

TABLE 1 Control Control 1 1 2 2 3 4 5 Component ULTEM ® 1010 100 99 9795 (wt %) ULTEM ® 1000 100 99 96 (wt %) PPO ® SA120 1 4 1 3 5 0.12 IV(wt %) Properties MVR, 360° C./ 20.4 21.7 27.6 40.4 40.2 46.3 51 5 kg(cc/10 min) Plate-plate MV, 1152 903 563 697 609 539 493 360° C. TensileModulus 3345 3271 3248 3334 3333 3329 3331 (MPa) Tensile Yield 114 114112 109 110 112 111 Stress (MPa) Tensile 11 23 13 5 8 13 8 Elongation(%) Izod Notched 4.8 5.2 4.9 4.8 4.9 4.7 5.1 Impact (kJ/m²)Table 2: Control 3, Comparitive Example 1, and Example 6

Two formulations were prepared with 30 parts of 0.48 IV PPO® (Comp. 1)or 0.12 IV PPO® SA120 (Example 6) in a polyetherimide resin of ULTEM®1010. An unfilled polyetherimide resin was included as a control(Control 3). All formulations were compounded and molded into testspecimens consistent with the procedures outlined in the examples fromTable 1.

Test data in Table 2 indicates that the use of low IV PPO® in place ofthe 0.48 IV PPO® resulted in a significant improvement in flow. Althoughthere is a decrease in the tensile and impact properties with the use oflow IV PPO® at these high loadings, the properties are suitable for avariety of applications.

TABLE 2 Units Control 3 Comp 1 6 Component ULTEM ® 1010 wt % 100 70 70PPO ® 803, 0.48 IV wt % — 30 — PPO ® SA120, 0.12 IV wt % — — 30Properties MVR, 295° C./10 kg cc/10 min 0.5 8 60 Tensile Modulus MPa3300 3000 3200 Tensile Yield Stress MPa 116 93 46 Tensile Elongation %16 5 1 Izod Unnotched Impact kJ/m² 60 51 8 Vicat-B ° C. 213 209 196Table 3: Control 4, Comparative Examples 2–4, and Examples 7–9

Polyetherimide formulations containing 20 parts of chopped glass fiberwith 0, 3, 5, and 7 parts of either a 0.46 IV PPO® or 0.12 IV PPO® SA120were dry blended and compounded in a 2.5 inch Egan single screw extruderoperating at a temperature of 360° C. and 100 rpm. The glass fiber wasfed in the feed throat. The extrudate was quenched in a water bath andpelletized.

The pellets were dried for a minimum of 4 hours at 140° C. beforemolding into various ASTM test specimens using a 150 ton Newburyinjection molding machine at a melt temperature of 360° C. and a moldtemperature of 140° C. The results of the various physical andmechanical properties are reported in Table 3. Details of the testprocedures follow the tabulated data.

As determined by capillary rheometry and melt flow rate (MFR), theformulations containing the low IV PPO® SA120, Examples 8, 9 and 10,have significantly better flow than the formulations made with thehigher IV PPO®. Also, there is no loss in tensile properties or HDTvalues with loadings up to 5 wt %. In Example 10, there is a reductionin tensile strength and elongation, but the properties are sufficientfor a variety of applications.

TABLE 3 Control 4 7 Comp 2 8 Comp 3 9 Comp 4 Component ULTEM ® 1010 8077 77 75 75 73 73 (wt %) PPO ® SA120, 3 5 7 0.12 IV (wt %) PPO ® 6460.46 3 5 7 IV (wt %) Glass (wt %) 20 20 20 20 20 20 20 PropertiesCapillary MV, 245 186 233 127 222 86 215 337° C. @ 5120 s⁻¹ (Pa-s) MFR13.5 14.4 12.4 16.6 12.6 23.3 12.7 337° C./6.6 kg (cc/10 min) TensileModulus 926 950 1024 1110 1010 1224 1006 (Kpsi) Tensile Yield 21 21 21.419.1 20.6 12.8 19.7 Stress (Kpsi) Tensile 3.6 3 3 2.2 3 1.4 2.9Elongation (%) HDT (° C.) 209 209 210 208 210 208 210 UL 94, V-0 16 1616 16 Thickness (mils)Table 4: Control 5 and Examples 10–12

Polyetherimide formulations containing 30 parts chopped glass fiberswith 0, 1, 3, and 5 parts, respectively, of low IV PPO® SA120 werecompounded and molded at 380° C. using similar procedures outlined inTable 1. The glass fibers were side fed into the 28 mm WP extruder. Datafrom Examples 10–12 show an improvement in flow without a significantloss in mechanical or impact performance when compared to Control 5.

TABLE 4 Control Units 5 10 11 12 Component ULTEM ® 1010 wt % 70 69 67 65PPO ® SA120, 0.12 IV wt % — 1 3 5 Glass wt % 30 30 30 30 Properties MVR,360° C./5 kg cc/10 15.8 16.9 20.3 20.3 min Tensile Modulus MPa 9533 95189366 9754 Tensile Yield Stress MPa 162 161 154 149 Tensile Elongation %3.2 3.2 2.8 2.4 Izod Unnotched Impact kJ/m² 43 42 39 38Table 5: Control 6, Comparative Example 5 and Example 13

Polyetherimide formulations containing 30 parts chopped glass fiberswith 21 parts of either 0.48 IV PPO (Comp 5) or low IV PPO® SA120(Example 13) were compounded and molded according to the proceduresoutlined in Table 1 & 4. Example 13, which contains the low IV PPO®SA120, flows significantly better than either the control or theformulation containing the higher IV PPO®. However, at high loadings,there is a decrease in the tensile, impact, and HDT performance but theproperties are still suitable for certain applications.

TABLE 5 Units Control 6 Comp 5 13 Component ULTEM ® 1010 wt % 70 49 49PPO ® 803, 0.48 IV wt % — 21 — PPO ® SA120, 0.12 IV wt % — — 21 Glass wt% 30 30 30 Properties MVR, 295° C./10 kg cc/10 min 0.5 2 23 TensileModulus Mpa 10100 9400 8700 Tensile Yield Stress Mpa 157 124 73 TensileElongation % 3 2 1 Izod Unnotched Impact kJ/m² 60 16 10 Vicat-B ° C. 214214 203Table 6: Control 7 and Examples 14–16

In Tables 6–8, three polysulfones obtained from BP Amoco were studied:Udel® (polysulfone) grade P1700, RadelA® (polyethersulfone) grade A200,and RadelR® (polyphenylsulfone) grade R5000. Formulations were dry mixedand then melt compounded in a Werner and Pfleiderer 28 mm co-rotatingtwin screw extruder at temperatures corresponding to 360° C., 375° C.,and 400° C. for blends with Udel, RadelA, and RadelR, respectively. Thepelletized materials were dried overnight at 120° C. before injectionmolding into parts for mechanical testing. Injection molding wasperformed in a 30-ton Engel molding machine at melt temperatures of 340°C. and a mold temperature of 95° C. Room temperature notched Izod impactstrength, and tensile yield strength were then measured.

Polysulfone formulations containing 0, 2, 5, and 10 parts of low IV PPO®SA120 were compounded and molded according to the procedures outlinedabove. As compared to Control 7, Examples 14–16 demonstrate that theaddition of the low IV PPO® SA120 results in a significant improvementin melt flow without a significant reduction in either mechanicalstrength or impact properties.

TABLE 6 Control Units 7 14 15 16 Component Udel P1700 wt % 100 98 95 90PPO ® SA120, 0.12 IV wt % 0 2 5 10 Properties Capillary Viscosity, Pa-s455 427 234 84 360° C. @ 1000 s-1 Tensile Yield Strength Kpsi 10.2 10.310.4 10.6 Notched Izod @ 23° C. Ft-lb/in 1.2 1.1 0.9 0.8Table 7: Control 8 and Examples 17–19

Polyethersulfone formulations containing 0, 2, 5, and 10 parts of low IVPPO® SA120 were compounded and molded using the procedures outlined forTable 6. As compared to Control 8, formulations containing low IV PPOhave lower melt viscosities while maintaining their mechanical andimpact properties.

TABLE 7 Control Units 8 17 18 19 Component Radel A, A200 wt % 100 98 9590 PPO ® SA120, 0.12 IV wt % 0 2 5 10 Properties Capillary Viscosity,Pa-s 322 204 90 38 360° C. @ 1000 s⁻¹ Tensile Yield Strength Kpsi 11.311.3 11.4 — Notched Izod @ 23° C. Ft-lb/in 1.7 1.3 0.9 —Table 8: Control 9 and Examples 20 and 21

Formulations containing 0, 2, and 5 parts of low IV PPO® SA120 inpolyphenylsulfone were compounded and molded using the proceduresdescribed in Table 6. As seen in Table 8, the addition of low IV PPO inthe formulation reduces the melt viscosity while retaining the excellenttensile strength and impact properties of polyphenylsulfone.

TABLE 8 Units Control 9 20 21 Component Radel R, R5000 wt % 100 98 95PPO ® SA120, 0.12 IV wt % 0 2 5 Properties Capillary Viscosity, Pa-s 460439 160 360° C. @ 1000 s⁻¹ Tensile Yield Strength Kpsi 11.1 10.7 —Notched Izod @ 23° C. Ft-lb/in 15.7 12.8 —

EXPERIMENTAL

The poly(imide) resins employed were ULTEM® 1000-1000 with aweight-average molecular weight of 63,000 g/mol, and ULTEM® 1010-1000with a weight-average molecular weight of 53,000 g/mol, while thepoly(arylene ether) resins employed were PPO® 803 with an intrinsicviscosity (IV) of 0.48 dl/g, PPO® 646 with an IV of 0.46 dl/g, and PPO®SA120 with an IV of 0.12 dl/g, all commercially available from G.E.Plastics, Pittsfield, Mass. PPO® SA120 is poly(2,6-dimethyl-1,4-phenylene) ether in a pelletized form with an averagesize of approximately ⅙ inches (3 mm) after recovery from a reactionsolution with a vented extruder. Three polysulfones obtained from Amocowere studied: Udel® (polysulfone) grade P1700, Radel A®(polyethersulfone) grade A200, and Radel R® (polyphenylsulfone) gradeR5000. The chopped glass fiber that was used is G-filament glass (⅛inches) sized with silane coupling agent available from Owens Corning.

Melt volume rate (MVR) was determined according to ISO 1133, using aZwick capillary rheometer at either 295° C. or 360° C. A Tinius Olsencapillary rheometer with a 6.6 kg load was used to determine the meltflow rate (MFR) according to ASTM 1238. Mechanical properties weredetermined according to ISO 527, ISO 180, ASTM 638, and ASTM 790standards. Plate-plate melt viscosity (MV) was determined at 360° C.using a Rheometrics Dynamic Rheometer, while the capillary MV wasperformed at 337° C. with a Rheometrics Capillary Rheometer. Viscositymeasurements on the formulations containing the various polysulfoneswere made by capillary rheometry using a Goettfert Rheograph model 2002equipped with a 12 mm diameter piston and a 30/1 L/D capillary dieoperated at 360° C. The molecular weights of the ULTEM® resins weredetermined by gel permeation chromatography (GPC) using chloroform as asolvent. Intrinsic viscosity (IV) is measured in chloroform at 25° C. inunits of deciliters/gram (dl/g). ISO 306 or ASTM 648 was used to measuredeformation under load as a function of temperature of a thermoplasticpart. The temperature at which the part deforms according to the ISOnorm is defined as the Vicat temperature and is defined as the heatdistortion temperature (HDT) under the ASTM standard, in ° C. Tests forflame retardancy were performed according to UL-94 protocol for a VOrating using 20 test bars of the polyphenylene ether formulations withthe dimensions: 5 inches by 0.5 inches by 1.5 mm.

The compositions made in the above examples were tested for flammabilityusing a flame retardant testing tool which provides a prediction of thelikelihood that a particular UL standard, such as UL-94 will be passed.The UL-94 protocol calls for bar-shaped specimens of dimensions 5 inches(12.7 cm)×0.5 inches (1.3 cm) width×the desired normal thickness, UL-94ratings being specified for a particular thickness. A flame having aninner cone of height 0.75 inches (1.9 cm) is applied to each specimen sothat a distance of 0.375 inches (1.0 cm) separates the lower end of thespecimen from base of the flame. The flame is held in that position for10 seconds and then removed. A burn time is defined as the time requiredfor the flame issuing from the specimen to disappear. If burning of thespecimen ceases within 30 seconds, the flame is reapplied for anadditional 10 seconds. The criteria for V-0, V-1, and V-2 ratings arelisted below in Table 9.

TABLE 9 Vertical Flame Class Requirements 94V-0 94V-1 94V-2 Individualburn time (seconds) ≦10 ≦30 ≦30 Total burn time (seconds) ≦50 ≦250 ≦250(5 specimens) Glowing time (seconds) (individual ≦30 ≦60 ≦60 specimen)Drip particles that ignite cotton NO NO YES “≦” means less than or equalto.

For a V-0 rating, no individual burn times, from the first or secondapplication may exceed 10 seconds. The total of the burn times for anyfive specimens may not exceed 50 seconds. Drip particles that ignite apiece of cotton gauze situated below the specimen are not allowed. Thevalues listed in Table 3 represent the minimum thickness for all 20samples passing the V-0 criteria.

Each of the tables represents a single experiment. For each example in agiven table the compounding/molding/testing conditions were the same.

In each set of experiments, a reference lacking a poly(arylene ether)was included. Each set of data shows the improvement in flow asreflected by measurement of MVR, MFR, Plate-Plate MV, or capillary MVupon addition of a low IV poly(arylene ether) (PPO® SA120) to theformulation.

The above examples demonstrate the improved melt flow of highperformance thermoplastic polymers that have a poly(arylene ether) (forexample, polyphenylene ether), component. No significant loss ofmolecular weight, tensile properties, heat resistance, or impactstrength occurred with the addition of the polyphenylene ether.

While preferred embodiments have been shown and described, variousmodifications and substitutions may be made thereto without departingfrom the spirit and scope of the invention. Accordingly, it is to beunderstood that the present invention has been described by way ofillustration and not limitation.

1. A thermoplastic resin composition, comprising, based upon the totalweight of the composition about 40 wt % to about 99.9 wt % of a high Tgamorphous thermoplastic polymer resin selected from the group consistingof poly(imide) polymers, poly (amide imide) polymers, poly(sulfone)polymers, poly(ether sulfone) polymers, poly(etherimide) polymers andcombinations of the foregoing resins; about 0.1 wt % to about 50 wt % ofan unfunctionalized poly(arylene ether) having an intrinsic viscosity ofabout 0.10 to about 0.15 dl/g, as measured in chloroform at 25° C.; andan additive.
 2. The thermoplastic resin composition of claim 1, whereinthe additive is selected from the group consisting of fillers,reinforcing agents, conductive materials, mold release agents, anti-dripagents, compatibilizers, UV absorbers, stabilizers, lubricants,plasticizers, pigments, dyes, colorants, anti-static agents, blowingagents, anti-oxidants, flame retardants, impact modifiers,crystallization nucleators, and mixtures of the foregoing additives. 3.The thermoplastic resin composition of claim 1, wherein the additive isselected from the group consisting of silicates, titanium dioxide,ceramics, continuous glass fibers, chopped glass fibers, milled glassfibers, glass spheres, glass particles, glass flakes, carbon black,graphite, calcium carbonate, talc, mica, carbon fibers, carbonnanotubes, metal flakes, metal particles, metal fibers, metal coatedmicas, metal coated fibers, metal coated glass flakes, and mixtures ofthe foregoing additives.
 4. The thermoplastic resin composition of claim1, wherein the additive is present in amount of about 0.1 to about 50 wt% based on the total weight of the composition.
 5. The thermoplasticresin composition of claim 4, wherein the additive is present in amountof about 5 to about 40 wt % based on the total weight of thecomposition.
 6. The thermoplastic resin composition of claim 5, whereinthe additive is present in amount of about 15 to about 30 wt % based onthe total weight of the composition.
 7. The thermoplastic resincomposition of claim 1, comprising about 50 wt % to about 99 wt % of thehigh Tg amorphous thermoplastic polymer resin and about 1.0 wt % toabout 40 wt % of the poly(arylene ether).
 8. The thermoplastic resincomposition of claim 7, comprising about 70 wt % to about 95 wt % of thehigh Tg amorphous thermoplastic polymer resin and about 5 wt % to about30 wt % of the poly(arylene ether).
 9. The thermoplastic resincomposition of claim 1, wherein the poly(arylene ether) comprises aplurality of structural units of the formula (XII)

wherein each Q¹ is independently a halogen, primary or secondary loweralkyl having one to four carbon atoms, phenyl, haloalkyl, aminoalkyl,hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atomsseparate the halogen and oxygen atoms; each Q² is independently ahydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl,hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atomsseparate the halogen and oxygen atoms; and n is less than
 50. 10. Thethermoplastic resin composition of claim 9, wherein n is less than about40.
 11. The thermoplastic resin composition of claim 9, wherein each Q¹is C₁₋₄ alkyl or phenyl, and Q² is hydrogen.
 12. The thermoplastic resincomposition of claim 9, wherein the poly(arylene ether) is a homopolymercomprising 2,6-dimethylphenylene ether units, a copolymer comprising2,6-dimethylphenylene ether and 2,3,6-trimethyl-1,4-phenylene etherunits, or a copolymer derived from copolymerization of2,6-dimethylphenol with 2,3,6-trimethyl phenol.
 13. The thermoplasticresin composition of claim 10, wherein n is about 10 to about
 25. 14.The thermoplastic resin composition of claim 1, wherein the poly(imide)comprises the structural units of the formula (I)

wherein a is more than 1; V is a tetravalent linker selected from thegroup consisting of (a) substituted or unsubstituted, saturated,unsaturated or aromatic monocyclic and polycyclic groups having about 5to about 50 carbon atoms, (b) substituted or unsubstituted, linear orbranched, saturated or unsaturated alkyl groups having 1 to about 30carbon atoms, and (c) combinations thereof, wherein the substitutionsare ethers, epoxides, amides, esters, or combinations of the foregoingtetravalent linkers; and R is a divalent organic radical selected fromthe group consisting of (a) aromatic hydrocarbon radicals having about 6to about 20 carbon atoms or halogenated derivatives thereof, (b)straight or branched chain alkylene radicals having about 2 to about 20carbon atoms; (c) cycloalkylene radicals having about 3 to about 20carbon atoms, and (d) divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)— and halogenatedderivatives thereof, wherein y is an integer from 1 to
 10. 15. Thethermoplastic resin composition of claim 14, wherein a is about 10 toabout
 1000. 16. The thermoplastic resin composition of claim 14, whereina is about 10 to about
 500. 17. The thermoplastic resin composition ofclaim 14, wherein V is selected from the group consisting of thetetravalent aromatic radicals of formula (II):

and halogenated derivatives of tetravalent aromatic radicals of formula(II), wherein W is a divalent moiety selected from the group consistingof —O—, —S—, —C(O)—, —SO₂—, CyH_(2y), C_(y)H_(2y-2)—, and halogenatedderivatives thereof, wherein y is an integer from 1 to 10, and a groupof the formula —O-Z-O— wherein the divalent bonds of the —O— or the—O-Z-O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, andwherein Z is selected from the group consisting of divalent radicals offormula (III)


18. The thermoplastic resin composition of claim 1, wherein thepoly(etherimide) polymer comprises structural units of the formula (V)

wherein T is —O— or a group of the formula —O-Z-O— wherein the divalentbonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, orthe 4,4′ positions; and wherein Z is one or more of the divalentradicals of formula (III)

R is a divalent organic radical selected from the group consisting of(a) aromatic hydrocarbon radicals having about 6 to about 20 carbonatoms or halogenated derivatives thereof, (b) straight or branched chainalkylene radicals having about 2 to about 20 carbon atoms; (c)cycloalkylene radicals having about 3 to about 20 carbon atoms, and (d)divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)— and halogenatedderivatives thereof, wherein y is an integer from 1 to
 10. 19. Thethermoplastic resin composition of claim 18, wherein thepoly(etherimide) further comprises the polyimide structural units of theformula (VI)

wherein R is a divalent organic radical selected from the groupconsisting of (a) aromatic hydrocarbon radicals having about 6 to about20 carbon atoms or halogenated derivatives thereof, (b) straight orbranched chain alkylene radicals having about 2 to about 20 carbonatoms; (c) cycloalkylene radicals having about 3 to about 20 carbonatoms, and (d) divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)—, and halogenatedderivatives thereof, wherein y is an integer from 1 to 5; and wherein Mis one or more of the radicals of formula (VII)


20. The thermoplastic resin composition of claim 18, wherein the R isindependently p-phenylene, m-phenylene, or a mixture comprising of theforegoing and T is a divalent radical of the formula (XI)


21. The thermoplastic resin composition of claim 1, wherein thepoly(imide) is prepared by reaction of a first material selected fromthe group consisting of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride,2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl-2,2-propanedianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylether dianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfidedianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenonedianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride, and mixtures of the foregoing first materials, witha second material selected from the group consisting of ethylenediamine,propylenediamine, trimethylenediamine, diethylenetriamine,triethylenetetramine, hexamethylenediamine, heptamethylenediamine,octamethylenediamine, nonamethylenediamine, decamethylenediamine,1,12-dodecanediamine, 1,18-octadecanediamine,3-methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine,4-methylnonamethylenediamine, 5-methylnonamethylenediamine,2,5-dimethylhexamethylenediamine, 2,5-dimethylheptamethylenediamine,2,2-dimethylpropylenediamine, N-methyl-bis (3aminopropyl) amine,3-methoxyhexamethylenediamine, 1,2-bis(3-aminopropoxy) ethane,bis(3-aminopropyl) sulfide, 1,4-cyclohexanediamine,bis-(4-aminocyclohexyl) methane, m-phenylenediamine, p-phenylenediamine,2,4-diaminotoluene, 2,6-diaminotoluene, m-xylylenediamine,p-xylylenediamine, 2-methyl-4,6-diethyl-1,3-phenylenediamine,5-methyl-4,6-diethyl-1,3-phenylene-diamine, benzidine,3,3′-dimethylbenzidine, 3,3′-dimethoxybenzidine, 1,5-diaminonaphthalene,bis(4-aminophenyl) methane, bis(2-chloro-4-amino-3,5-diethylphenyl)methane, bis(4-aminophenyl) propane, 2,4-bis(b-amino-t-butyl) toluene,bis(p-b-amino-t-butylphenyl) ether, bis(p-b-methyl-o-aminophenyl)benzene, bis(p-b-methyl-o-aminopentyl) benzene,1,3-diamino-4-isopropylbenzene, bis(4-aminophenyl) sulfide, bis(4-aminophenyl) sulfone, bis(4-aminophenyl) ether,1,3-bis(3-aminopropyl) tetramethyldisiloxane, and mixtures of theforegoing second materials.
 22. The thermoplastic resin composition ofclaim 1, wherein the poly(etherimide) is prepared by reaction ofaromatic dianhydrides selected from the group consisting of pyromelliticdianhydride, 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride,and mixtures of the foregoing dianhydrides, with diamines selected fromthe group consisting of aliphatic diamines, hexamethylenediamine,1,3-bis(3-aminopropyl) tetramethyldisiloxane, m-phenylenediamine,p-phenylenediamine, or mixtures of the foregoing diamines.
 23. Thethermoplastic resin composition of claim 1, wherein the high Tgamorphous thermoplastic polymer has a Tg of about 170° C. or greater.24. The thermoplastic resin composition of claim 23, wherein the high Tgamorphous thermoplastic polymer has a Tg of about 200° C. or greater.25. The thermoplastic resin composition of claim 1, wherein thepoly(arylene ether) was recovered from a reaction solution as a solidmass and granulated or pelletized to a desired size or is recovered froma reaction solution as an agglomerate with an average particle sizegreater than 100 μm.
 26. The thermoplastic resin composition of claim 1,wherein the poly(arylene ether) was recovered from a reaction solutionof the poly(arylene ether) as a solid mass by evaporating solvent fromsaid reaction solution in a film evaporator, cooling the recoveredpoly(arylene ether) to form a solid and granulating or pelletizing thesolid.
 27. The thermoplastic resin composition of claim 1, wherein thepoly(arylene ether) is recovered from a reaction solution of thepoly(arylene ether) as a solid mass by evaporating solvent from saidreaction solution with a vented extruder and extruding the poly(aryleneether), cooling the extruded poly(arylene ether) to from a solid andgranulating or pelletizing the solid.
 28. A thermoplastic resincomposition comprising, based upon the total weight of the composition,about 0.1 wt % to about 50 wt % of an unfunctionalized poly(aryleneether) having an intrinsic viscosity of about 0.10 to about 0.15 dl/g,as measured in chloroform at 25° C., wherein the poly(arylene ether)polymer comprises a plurality of structural units of the formula (XII)

wherein each Q¹ is independently a halogen, primary or secondary loweralkyl having one to four carbon atoms, phenyl, haloalkyl, aminoalkyl,hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atomsseparate the halogen and oxygen atoms; each Q² is independently ahydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl,hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atomsseparate the halogen and oxygen atoms; and n is less than 50; about 40wt % to about 99.9 wt % of a high Tg amorphous thermoplastic polymerresin, wherein the high Tg amorphous thermoplastic polymer resincomprises structural units of the formula (V)

wherein T is —O— or a group of the formula —O-Z-O— wherein the divalentbonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, orthe 4,4′ positions; and wherein Z is one or more of the divalentradicals of formula (III):

R is a divalent organic radical selected from the group consisting of(a) aromatic hydrocarbon radicals having about 6 to about 20 carbonatoms or halogenated derivatives thereof, (b) straight or branched chainalkylene radicals having about 2 to about 20 carbon atoms; (c)cycloalkylene radicals having about 3 to about 20 carbon atoms, and (d)divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)—, and halogenatedderivatives thereof, wherein y is an integer from 1 to 10; and anadditive.
 29. The thermoplastic resin composition of claim 28,comprising about 50 wt % to about 99 wt % of the high Tg amorphousthermoplastic polymer resin and about 1 wt % to about 40 wt % of thepoly(arylene ether).
 30. The thermoplastic resin composition of claim29, comprising about 70 wt % to about 95 wt % of the high Tg amorphousthermoplastic polymer resin and about 5 wt % to about 30 wt % of thepoly(arylene ether).
 31. The thermoplastic resin composition of claim28, wherein each Q¹ is C₁₋₄ alkyl or phenyl, and Q² is hydrogen.
 32. Thethermoplastic resin composition of claim 28, wherein the high Tgamorphous thermoplastic resin further comprises poly(imide) structuralunits of the formula (VI)

wherein R is a substituted or unsubstituted divalent organic radicalselected from the group consisting of (a) aromatic hydrocarbon radicalshaving about 6 to about 20 carbon atoms or halogenated derivativesthereof, (b) straight or branched chain alkylene radicals having about 2to about 20 carbon atoms; (c) cycloalkylene radicals having about 3 toabout 20 carbon atoms, and (d) divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)—, and halogenatedderivatives thereof, wherein y is an integer from 1 to 10; and M is oneor more of the radicals of formula (VII)


33. The thermoplastic resin composition of claim 28, wherein the high Tgamorphous thermoplastic polymers are prepared by reaction of a firstmaterial selected from the group consisting of2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride,4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride,2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride,4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl-2,2-propanedianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylether dianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfidedianhydride,4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenonedianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride, and mixtures of the foregoing first materials, witha second material selected from the group consisting of ethylenediamine,propylenediamine, trimethylenediamine, diethylenetriamine,triethylenetetramine, hexamethylenediamine, heptamethylenediamine,octamethylenediamine, nonamethylenediamine, decamethylenediamine,1,12-dodecanediamine, 1,18-octadecanediamine,3-methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine,4-methylnonamethylenediamine, 5-methylnonamethylenediamine,2,5-dimethylhexamethylenediamine, 2,5-dimethylheptamethylenediamine,2,2-dimethylpropylenediamine, N-methyl-bis (3-aminopropyl) amine,3-methoxyhexamethylenediamine, 1,2-bis(3-aminopropoxy) ethane,bis(3-aminopropyl) sulfide, 1,4-cyclohexanediamine,bis-(4-aminocyclohexyl) methane, m-phenylenediamine, p-phenylenediamine,2,4-diaminotoluene, 2,6-diaminotoluene, m-xylylenediamine,p-xylylenediamine, 2-methyl-4,6-diethyl-1,3-phenylenediamine,5-methyl-4,6-diethyl-1,3-phenylene-diamine, benzidine,3,3′-dimethylbenzidine, 3,3′-dimethoxybenzidine, 1,5-diaminonaphthalene,bis(4-aminophenyl) methane, bis(2-chloro-4-amino-3,5-diethylphenyl)methane, bis(4aminophenyl) propane, 2,4-bis(b-amino-t-butyl) toluene,bis(p-b-amino-t-butylphenyl) ether, bis(p-b-methyl-o-aminophenyl)benzene, bis(p-b-methyl-o-aminopentyl) benzene,1,3-diamino-4-isopropylbenzene, bis(4-aminophenyl) sulfide, bis(4-aminophenyl) sulfone, bis(4-aminophenyl) ether,1,3-bis(3-aminopropyl) tetramethyldisiloxane, and mixtures of theforegoing second materials.
 34. The thermoplastic resin composition ofclaim 28, wherein the high Tg amorphous thermoplastic polymers areprepared by reaction of aromatic dianhydrides selected from the groupconsisting of pyromellitic dianhydride,2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, and mixturesof the foregoing dianhydrides, with diamines selected from the groupconsisting of aliphatic diamines, hexamethylenediamine,1,3-bis(3-aminopropyl) tetramethyldisiloxane, m-phenylenediamine,p-phenylenediamine, or mixtures of the foregoing diamines.
 35. Athermoplastic resin composition, consisting essentially of, based uponthe total weight of the composition about 40 wt % to about 99.9 wt % ofa high Tg amorphous thermoplastic polymer resin wherein the high Tgamorphous thermoplastic polymer resin is selected from the groupconsisting of poly (imide) polymers, poly(amide imide) polymers,poly(sulfone) polymers, poly(ether sulfone) polymers, poly(etherimide)polymers, and combinations of the foregoing high Tg amorphousthermoplastic polymer resins; and about 0.1 wt % to about 50 wt % of anunfunctionalized poly(arylene ether) having an intrinsic viscosity ofabout 0.10 to about 0.15 dl/g, as measured in chloroform at 25° C.
 36. Athermoplastic resin composition consisting essentially of, based uponthe total weight of the composition, about 0.1 wt % to about 50 wt % ofan unfunctionalized poly(arylene ether) having an intrinsic viscosity ofabout 0.10 to about 0.15 dl/g, as measured in chloroform at 25° C.,wherein the poly(arylene ether) polymer comprises a plurality ofstructural units of the formula (XII)

wherein each Q¹ is independently a halogen, primary or secondary loweralkyl having from one to four carbon atoms, phenyl, haloalkyl,aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least twocarbon atoms separate the halogen and oxygen atoms; each Q² isindependently a hydrogen, halogen, primary or secondary lower alkyl,phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy wherein at leasttwo carbon atoms separate the halogen and oxygen atoms; and n is lessthan 50; and about 40 wt % to about 99.9 wt % of a high Tg amorphousthermoplastic polymer resin, wherein the high Tg amorphous thermoplasticpolymer resin comprises structural units of the formula (V)

wherein T is —O— or a group of the formula —O-Z-O— wherein the divalentbonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, orthe 4,4′ positions; and wherein Z is one or more of the divalentradicals of formula (III):

R is a divalent organic radical selected from the group consisting of(a) aromatic hydrocarbon radicals having about 6 to about 20 carbonatoms or halogenated derivatives thereof, (b) straight or branched chainalkylene radicals having about 2 to about 20 carbon atoms; (c)cycloalkylene radicals having about 3 to about 20 carbon atoms, and (d)divalent radicals of the formula (IV)

wherein Q is a divalent moiety selected from the group consisting of—O—, —S—, —C(O)—, —SO₂—, C_(y)H_(2y)—, C_(y)H_(2y-2)—, and halogenatedderivatives thereof, wherein y is an integer from 1 to
 10. 37. Athermoplastic resin composition, consisting essentially of, based uponthe total weight of the composition about 40 wt % to about 99.9 wt % ofa high Tg amorphous thermoplastic polymer resin selected from the groupconsisting of poly(imide) polymers, poly (amide imide) polymers,poly(sulfone) polymers, poly(ether sulfone) polymers, poly(etherimide)polymers and combinations of the foregoing resins; about 0.1 wt % toabout 50 wt % of an unfunctionalized poly(arylene ether) having anintrinsic viscosity of about 0.10 to about 0.15 dl/g, as measured inchloroform at 25° C.; and an additive.